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SMAJ5.0A 力特现货

SMAJ5.0A 力特现货 2023-04-07 点击数:2686

SMAJ5.0A  力特现货,2022年新货,需要产品的可以出货,量大价优!

Description Features Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25° by 10/1000us Waveform(Fig.2)(Note 1), (Note 2) -Single Die Parts PPPM 400 W Peak Pulse Power Dissipation at TA=25° by 10/1000us Waveform(Fig.2)(Note 1), (Note 2)-Stacked Die Parts(Note 5) PPPM 600 W Power Dissipation on Infinite Heat Sink at TL =50OC PD 3.3 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) I FSM 60 A Maximum Instantaneous Forward Voltage at 25A for Unidirectional Only (Note 4) VF 3.5/5.0 V Operating Temperature Range TJ -65 to 150 °C Storage Temperature Range TSTG -65 to 175 °C Typical Thermal Resistance Junction to Lead RθJL 30 °C/W Typical Thermal Resistance Junction to Ambient RθJA 120 °C/W The SMAJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Applications TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. ■ 400W Peak Pulse Power capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01% ■ Excellent clamping capability ■ Typical IR less than 1μA when VBR min>12V ■ Surface mount footprint for compact PCB layout ■ Low profile package ■ Typical failure mode is short from over-specified voltage or current ■ Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c ■ IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) ■ ESD protection of data lines in accordance with IEC 61000-4-2 ■ EFT protection of data lines in accordance with IEC 61000- 4-4 ■ Built-in strain relief ■ Fast response time: typically less than 1.0ps from 0 Volts to VBR min ■ Glass passivated junction ■ Low inductance ■ High temperature to reflow soldering guaranteed: 260°C/30sec ■ VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%) ■ Plastic package is flammability rated V-0 per UL-94. ■ Meet MSL level1, per J-STD-020, LF maximun peak of 260°C ■ Matte tin, lead–free plated ■ Halogen free and RoHS compliant ■ Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01) Uni-directional Bi-directional Functional Diagra

功能与特色:

  • 无卤素,且符合RoHS标准
  • 表面封装可优化面板空间
  • 小尺寸封装
  • 内置式应力消除
  • 玻璃钝化结
  • 低电感
  • 出色的箝位能力
  • 重复频率(工作循环): 0.01%
  • 快速的响应时间: 从0伏特至VBR的单向最小值通常小于1.0ps
  • 电压高于10V时,标准IR小于1mA
  • 高温焊接: 接线端250°C./10秒
  • 塑料封装已获UL易燃性分级94V-O认证

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