SMAJ5.0A 力特现货
SMAJ5.0A 力特现货，2022年新货，需要产品的可以出货，量大价优！
Description
Features
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter Symbol Value Unit
Peak Pulse Power Dissipation at TA=25°
by 10/1000us Waveform(Fig.2)(Note 1),
(Note 2) -Single Die Parts
PPPM 400 W
Peak Pulse Power Dissipation at TA=25°
by 10/1000us Waveform(Fig.2)(Note 1),
(Note 2)-Stacked Die Parts(Note 5)
PPPM 600 W
Power Dissipation on Infinite Heat Sink
at TL
=50OC PD 3.3 W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3) I
FSM 60 A
Maximum Instantaneous Forward
Voltage at 25A for Unidirectional Only
(Note 4)
VF 3.5/5.0 V
Operating Temperature Range TJ -65 to 150 °C
Storage Temperature Range TSTG -65 to 175 °C
Typical Thermal Resistance Junction to
Lead RθJL 30 °C/W
Typical Thermal Resistance Junction to
Ambient RθJA 120 °C/W
The SMAJ series is designed specifically to protect sensitive
electronic equipment from voltage transients induced by lightning
and other transient voltage events.
Applications
TVS devices are ideal for the protection of I/O Interfaces, VCC bus
and other vulnerable circuits used in Telecom, Computer, Industrial
and Consumer electronic applications.
■ 400W Peak Pulse Power
capability at 10/1000µs
waveform, repetition rate
(duty cycle): 0.01%
■ Excellent clamping capability
■ Typical IR less than 1μA when
VBR min>12V
■ Surface mount footprint for
compact PCB layout
■ Low profile package
■ Typical failure mode is short
from over-specified voltage or
current
■ Whisker test is conducted
based on JEDEC JESD201A
per its table 4a and 4c
■ IEC-61000-4-2 ESD 30kV(Air),
30kV (Contact)
■ ESD protection of data lines
in accordance with IEC
61000-4-2
■ EFT protection of data lines in
accordance with IEC 61000-
4-4
■ Built-in strain relief
■ Fast response time: typically
less than 1.0ps from 0 Volts
to VBR min
■ Glass passivated junction
■ Low inductance
■ High temperature to reflow
soldering guaranteed:
260°C/30sec
■ VBR @ TJ= VBR@25°C
x (1+αT x (TJ - 25))
(αT:Temperature
Coefficient, typical value is
0.1%)
■ Plastic package is
flammability rated V-0 per
UL-94.
■ Meet MSL level1, per
J-STD-020, LF maximun peak
of 260°C
■ Matte tin, lead–free plated
■ Halogen free and RoHS
compliant
■ Pb-free E3 means 2nd level
interconnect is Pb-free and
the terminal finish material is
tin(Sn) (IPC/JEDEC J-STD609A.01)
Uni-directional Bi-directional
Functional Diagra
功能与特色:
- 无卤素，且符合RoHS标准
- 表面封装可优化面板空间
- 小尺寸封装
- 内置式应力消除
- 玻璃钝化结
- 低电感
- 出色的箝位能力
- 重复频率（工作循环）: 0.01%
- 快速的响应时间: 从0伏特至VBR的单向最小值通常小于1.0ps
- 电压高于10V时，标准IR小于1mA
- 高温焊接: 接线端250°C./10秒
- 塑料封装已获UL易燃性分级94V-O认证
